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1/25 ? semiconductor msm64169 ? semiconductor msm64169 built-in dual-slope type a/d converter and lcd driver 4-bit microcontroller general description the msm64169 is a low-power 4-bit microcontroller that incorporates oki's nx-4/30 cpu core. the msm64169 has a minimum instruction execution time of 4.3 m s (@ 700 khz). the device contains 8160 bytes of program memory, a 1024-nibble data memory, a dual-slopetype a/d converter with a 4-channel input, lcd drivers that can drive up to 240 segments, a synchronous/ asynchronous selectable serial port, a 16-bit timer, and a buzzer output port. applications include high resolution thermometers with low power consumption, barometers, and hygrometers. features ? operating range operating frequencies (dual clock) : 32 khz, 700 khz operating voltage : 2.6 v to 3.6 v operating temperature : C40 c to +85 c ? memory space internal program memory : 8160 bytes internal data memory : 1024 nibbles ? minimum instruction execution time : 4.3 m s (@ 700 khz) 91.6 m s (@ 32.768 khz) ? dual-slope type a/d converter : 1; 4-channel input ? lcd drivers : 64; duty ratio switchable by software (1) at 1/4 duty, 1/3 bias : 240 segments (max.) (2) at 1/3 duty, 1/3 bias : 183 segments (max.) (3) at 1/2 duty, 1/2 bias : 124 segments (max.) ? buzzer driver : 1; four modes for controlling buzzer output on/off ? timer : 16-bit 1 auto-reload mode capture mode clock frequency measuring mode ? watchdog timer ? clock : 32.768 khz quartz oscillator and 700 khz rc oscillator (with an external resistor) cpu clock : 32.768 khz/700 khz (selectable by software) time base clock : 32.768 khz ? power supply voltage : 3 v low power ? i/o port : 3 ports 4 bits ? output only port : 2 ports 4 bits (8 out of 64 lcd drivers can be used as output-only ports via mask programming) ? serial port : synchronous/asynchronous mode support synchronous mode : 32.768 khz/external clock asynchronous mode : 9600 bps/4800 bps/2400 bps/1200 bps ? interrupts : 10 sources (2 external, 8 internal) preliminary e2e0037-27-y3 this version: jan. 1998 previous version: mar. 1996
2/25 ? semiconductor msm64169 ? capture circuit : 2 channels ? package: 128-pin plastic qfp (qfp128-p-1420-0.50-k) : (product name: msm64169-xxxgs-k) chip : (product name: msm64169-xxx) xxx indicates the code number. ? otp version (under development) : (product name: msm64p169) note: the msm64p169 is diffrent from the msm64169 in the polarity of the power supply voltage and the operating voltage.refer to the msm64p169 user's manual for details.
3/25 ? semiconductor msm64169 block diagram bsr halt mief tr2 tr0 tr1 c alu ba pcm pcl (4) (4) (4) pch hl xy a11- a8 a7 - a0 db7- db0 (8) rom 8160b bias ram 1024n port address ir siop int (8) romr sp timing controller i r decoder db7- db0 port address adc is the cpu core (nx-4/30). v dd v ss1 v ss2 v ss3 c 1 c 2 lcd l0 l1 l63 v ss p0.0 p0.1 p1.3 v ss int p0 p1 v ss p2 int p2.0 p2.1 p2.2 p2.3 2 int v ssa opp1 opn1 opo1 opp0 opn0 opo0 v of v dda vra ain0 ain1 ain2 ain3 r a r i c z1 c i c z2 v g r cm bd tm intc wdt bd int int tbc int 2clk rstg tst vr osc2 osc1 xt xt reset tst1 tst2 v ssl 3 capr
4/25 ? semiconductor msm64169 pin configuration (top view) nc: no-connection pin 128-pin plastic qfp 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 v dda v g c z2 c i c z1 r cm r i r a ain3 ain2 ain1 (nc) ain0 v of (nc) (nc) (nc) (nc) (nc) vra 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 l12 l13 l14 l15 l16 l17 l18 l19 l20 l21 l22 l23 l24 l25 l26 l27 l28 l29 l30 l31 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 v ss3 c 1 c 2 v ss2 xt xt v dd osc1 osc2 l63 l62 l61 l60 l59 l58 l57 l56 (nc) l55 l54 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 opo0 opn0 opp0 op01 opn1 opp1 v ssa v ss p0.0 p0.1 (nc) p0.2 (nc) p0.3 (nc) p1.0 p1.1 (nc) p1.2 (nc) 82 l53 21 p1.3 81 (nc) 22 p2.0 80 l52 23 (nc) 79 l51 24 p2.1 108 v ssl 59 l32 107 reset 60 l33 106 tst2 61 l34 105 tst1 62 l35 104 bd 63 l36 103 v ss1 64 l37 78 l50 25 p2.2 77 l49 26 p2.3 76 (nc) 27 l0 75 l48 28 l1 74 l47 29 l2 73 l46 30 l3 72 l45 31 l4 71 l44 32 l5 70 l43 33 l6 69 l42 34 l7 68 l41 35 l8 67 l40 36 l9 66 l39 37 l10 65 l38 38 l11
5/25 ? semiconductor msm64169 pin descriptions basic functions function pin symbol pad 0v power supply bias output for lcd drive (C1.5v) negative power supply: bias output for lcd drive (C3.0v) bias output for lcd drive (C4.5v) negative power supply for input/output port interface capacitor connection for lcd-drive bias generation negative power supply pin for internal logic (internally generated constant voltage) negative power supply for a/d converter: externally connects to v ss2 . 0v power supply for a/d converter: externally connects to v dd . low speed clock oscillation input pin: connects to the crystal oscillator (32.768khz). high speed clock pins: connects to the oscillation resistor (r os ). input pins for test: pulled up to v dd internally. system reset input: when this pin is asserted to "h" after being pulled to "l", the microcontroller's internal state is initialized and instruction execution starts from address 000h. this pin is pulled up to v dd internally. type description 96 v dd 86 103 v ss1 93 99 v ss2 89 102 v ss3 92 v ss 7 8 c 1 91 power supply 100 c 2 90 108 v ssl 98 7v ssa 6 128 v dda 112 oscillation 98 xt 88 i 97 xt 87 o 95 osc1 85 i 94 osc2 84 o test 105 tst1 95 i 106 tst2 96 i reset 107 reset 97 i 101
6/25 ? semiconductor msm64169 basic functions (continued) function pin symbol pad 4-bit i/o port (p0): each bit can be configured to be an input/output, pull-up/pull-down resistor input/high impedance input, or nmos open drain output/cmos output by port 0 control registers 0-3 (p00con-p03con). an external interrupt function is assigned to each pin. 4-bit i/o port (p1): each bit can be configured to be an input/output, pull-up/pull-down resistor input/high impedance input, or nmos open drain output/cmos output by port 1 control registers 0-3 (p10con-p13con). an external interrupt function is assigned to each pin. 4-bit i/o port (p2): each bit can be configured to be an input/output, pull-up/pull-down resistor input/high impedance input, or nmos open drain output/cmos output by port 2 control registers 0-3 (p20con-p23con). an external interrupt function is assigned to each pin. output pin of buzzer driver analog voltage input pins. each of these pins can be switched to provide a constant current output by ad control register 0 (adcon0). current-adjusting resistor connection pin pin for connecting resistor for integration common connection pin for resistor for integration, capacitor 1 for offset compensation, and capacitor for integration. pin for connecting capacitor 1 for offset compensation pin for connecting capacitor for integration pin for connecting capacitor 2 for offset compensation reference voltage for a/d conversion (internally generated constant voltage) pin for connecting resistor for voltage amplification circuit offset adjustment analog micro-voltage input pin pin for connecting resistor for voltage amplification factor adjustment type description 9 p0.0 8 i/o 10 p0.1 9 i/o 12 p0.2 10 i/o ports buzzer 104 bd 94 o 116 ain0 101 i/o 118 ain1 102 i/o 119 ain2 103 i/o 120 ain3 104 i/o a/d converter 123 r cm 107 14 p0.3 11 i/o 16 p1.0 12 i/o 17 p1.1 13 i/o 19 p1.2 14 i/o 21 p1.3 15 i/o 22 p2.0 16 i/o 24 p2.1 17 i/o 25 p2.2 18 i/o 26 p2.3 19 i/o 121 r a 105 122 r i 106 124 c z1 108 125 c i 109 126 c z2 110 127 v g 111 109 vra 99 i 3 v of 100 i 6 opp0 2i 2 opp1 5i 5 opn0 1i 1 opn1 113 i 4 opo0 3 o 115 4 opo1 o
7/25 ? semiconductor msm64169 basic functions (continued) function pin symbol pad lcd segment/common signal output pins. these pins can also be mask-programmed to provide an output port. type description 27 l0/p3.0 20 o lcd drivers 28 l1/p3.1 21 o 29 l2/p3.2 22 o 30 l3/p3.3 23 o 31 l4/p4.0 24 o 32 l5/p4.1 25 o 33 l6/p4.2 26 o 34 l7/p4.3 27 o 35 l8 28 o 36 l9 29 o 37 l10 30 o 38 l11 31 o 39 l12 32 o 40 l13 33 o 41 l14 34 o 42 l15 35 o 43 l16 36 o 44 l17 37 o 45 l18 38 o 46 l19 39 o 47 l20 40 o 48 l21 41 o 49 l22 42 o 50 l23 43 o 51 l24 44 o 52 l25 45 o 53 l26 46 o 54 l27 47 o 55 l28 48 o 56 l29 49 o 57 l30 50 o lcd segment/common signal output pins
8/25 ? semiconductor msm64169 basic functions (continued) function pin symbol pad lcd segment/common signal output pins type description 58 l31 51 o lcd drivers 59 l32 52 o 60 l33 53 o 61 l34 54 o 62 l35 55 o 63 l36 56 o 64 l37 57 o 65 l38 58 o 66 l39 59 o 67 l40 60 o 68 l41 61 o 69 l42 62 o 70 l43 63 o 71 l44 64 o 72 l45 65 o 73 l46 66 o 74 l47 67 o 75 l48 68 o l49 69 o 77 l50 70 o 78 l51 71 o 79 l52 72 o 80 l53 73 o l54 74 o 82 l55 75 o 83 l56 76 o 84 l57 77 o l58 78 o 86 l59 79 o 87 l60 80 o 88 l61 81 o 89 l62 82 o 90 l63 83 o 91 92 93
9/25 ? semiconductor msm64169 secondary functions function pin symbol pad external level-sensitive interrupt input pins type description 9 p0.0 i 10 p0.1 12 p0.2 14 p0.3 16 p1.0 17 p1.1 19 p1.2 21 p1.3 22 p2.0 24 p2.1 25 p2.2 26 p2.3 10 p0.1 i 22 p2.0 i/o 24 p2.1 i/o 25 p2.2 o 9 p0.0 i 12 p0.2 i 26 p2.3 o 8 9 10 11 12 13 14 15 16 17 18 19 9 16 17 18 8 10 19 receive data input pin (rxd) of serial port transmit clock input/output pin (txt) of serial port receive clock output pin (rxc) of serial port transmit data output pin (txd) of serial port capture trigger input pin of timer external clock input pin (tmc) of timer timer overflow flag output pin (tmo) of timer external interrupts serial port timer 16 p1.0 i 12 17 p1.1 13 trigger input pin of the capture circuit i capture trigger
10/25 ? semiconductor msm64169 memory maps program memory 1fffh 1fe0h 03eh 020h 010h 000h start address czp area interrupt area test program area 32 bytes 8160 bytes 8 bits 03bh 038h 035h 032h 02fh 02ch 029h 026h 023h 020h 1fdfh watchdog interrupt external interrupt (0) serial port receive interrupt serial port transmit interrupt external interrupt (1) timer interrupt adc interrupt 32 hz interrupt 16 hz interrupt 1 hz interrupt address 000h is the start address of the instruction execution at system reset. the "czp" area from address 010h to 01fh is the start address for the czp subroutine of one- byte call instruction. the interrupt area from address 020h to 3dh is assigned the start address of interrupt subroutines. 8160 bytes from address 000h to 1fdfh are available for users. the test program area cannot be used as a program memory area.
11/25 ? semiconductor msm64169 data memory the data memory area consists of eight banks and each bank has 256 nibbles (256 4 bits). the data ram is assigned to bank 4 through bank 7 and special function registers (sfrs) are assigned to bank 0. 7ffh bank 7 4 bits 0ffh 000h stack area (256 nibbles)(also serves as data memory area) contents of 000h to 0ffh sfr area 0ffh 000h inaccessible area 100h 700h 6ffh 600h 5ffh 500h 4ffh 400h bank 6 bank 5 bank 4 data ram area bank 0 quarter the data ram area (256 nibbles) also serves as the stack area. the stack is a memory starting from address 7ffh toward the lower-order addresses where 4 nibbles are used by subroutine call instruction and 8 nibbles are used by an interrupt. it has no access to the area from bank 1 to bank 3.
12/25 ? semiconductor msm64169 absolute maximum ratings (v dd =v dda =0 v) parameter symbol condition rating unit power supply voltage 1 v ss1 ta=25c C2.0 to +0.3 v power supply voltage 2 v ss2 ta=25c C4.0 to +0.3 v power supply voltage 3 v ss3 ta=25c C5.5 to +0.3 v power supply voltage 4 v ssl ta=25c C4.0 to +0.3 v power supply voltage 5 v ss ta=25c C5.5 to +0.3 v power supply voltage 6 v ssa ta=25c C4.0 to +0.3 v input voltage 1 v in1 v ss2 input, ta=25c v ss2 C0.3 to +0.3 v input voltage 2 v in2 v ss input, ta=25c v ss C0.3 to +0.3 v input voltage 3 v in3 v ss1 input, ta=25c v ss1 C0.3 to +0.3 v input voltage 4 v in4 v ssa input, ta=25c v ssa C0.3 to +0.3 v output voltage 1 v out1 v ss2 output, ta=25c v ss2 C0.3 to +0.3 v output voltage 2 v out2 v ss3 output, ta=25c v ss3 C0.3 to +0.3 v output voltage 3 v out3 v ss output, ta=25c v ss C0.3 to +0.3 v output voltage 4 v out4 v ss1 output, ta=25c v ss1 C0.3 to +0.3 v output voltage 5 v out5 v ssa output, ta=25c v ssa C0.3 to +0.3 v storage tempertaure t stg C55 to +125 c recommended operating conditions (v dd =v dda =0 v) parameter symbol condition range unit operating temperature t op C40 to +85 c operating voltage v ss2 v ss2 =v ssa C3.6 to C2.6 v v ssa v ss C5.25 to (0.8 ? v ss2 , C2.6 max) v 700 khz osc external resistor r os 90 to 300 k w crystal oscillator frequency f xt 30 to 66 khz (*) * indicates that the value of v ss is 80% of v ss2 and should not exceed C2.6 v.
13/25 ? semiconductor msm64169 electrical characteristics dc characteristics v ss1 voltage v ss1 +100% C50% C1.7 C1.5 C1.3 v ca, cb, c12=0.1 m f v ss3 voltage v ss3 C4.7 C4.5 C4.3 v ca, cb, c12=0.1 m f C2.1 C1.5 C0.6 v within 5 seconds after oscillation starts v ssl voltage xtosc oscillation start voltage v sta v C2.6 xtosc oscillation hold voltage v hold xtosc stop detection time t stop ms 1000 xtosc internal capacitance c g pf 20 when c g external option is used xtosc external capacitance c gex pf 30 xtosc internal capacitance c d pf 20 700kosc internal capacitance c os pf 16 0.1 15 10 10 15 10 12 8 external resistor r os =100 k w , v ss2 =C2.6 to C3.6 v 700kosc oscillation frequeney khz 910 700 520 f osc por generated when v ss2 is between v por1 and C3.0 v por generation voltage v 0 C0.7 v por1 no por generated when v ss2 is between v por2 and C3.0 v por non-generation voltage v C2 C3 v por2 1 C2.6 v parameter symbol condition unit measur- ing circuit max. typ. min. v ssl (v dd =v dda =0 v, v ss2 =v ss = C3.0 v, ta= C40 to +85c unless otherwise specified) +100% C50% notes: 1. "xtosc" means a 32 khz oscillation circuit. 2. "700kosc" means 700 khz rc oscillation circuit. 3. "por" means power-on reset. 4. "t stop " means that system reset will occur if xtosc stops oscillation over this time.
14/25 ? semiconductor msm64169 dc characteristics (continued) parameter symbol condition min. typ. max. unit measur- ing circuit current consumption 1 i dd1 i dd2 cpu in halt state (700kosc stop) cpu in operation (700kosc stop) 1.2 4.5 m a 515 m a 200 300 m a 1 400 800 m a (v dd =v dda =0 v, v ss2 =v ss = C3.0 v, ta= C40 to +85c unless otherwise specified) current consumption 2 i dd3 cpu in operation (700kosc in operation) current consumption 3 i dd4 a/d converter in operation, cpu in halt state (700kosc stop) current consumption 4 voltage amplification circuit stop voltage amplification circuit in operation 400 600 m a
15/25 ? semiconductor msm64169 dc characteristics (continued) parameter symbol condition min. typ. max. unit measur- ing circuit output current 1 (p0.0 to p0.3) (p1.0 to p1.3) (p2.0 to p2.3) output current 2 (bd) output current 3 (r i , c i , opo0, opo1) output current 4 (when l0 to l7 are output ports) output current 5 (osc2) output current 6 (l0 to l30) output leakage (p0.0 to p0.3) (p1.0 to p1.3) (p1.0 to p1.3) i oh1 i ol1 i oh1s i ol1s i oh2 i ol2 i oh3 i ol3 i oh4 i ol4 i oh4s i ol4s i oh5 i ol5 i oh6 i omh6 i omh6s i oml6 i oml6s i ol6 i ooh i ool v oh1 =C0.5 v v ol1 =v ss +0.5 v v ss =C5 v, v oh1s =C0.5 v v ss =C5 v, v ol1s =v ss +0.5 v v oh2 =C0.7 v v ol2 =v ss2 +0.7 v v oh3 =C0.5 v v ol3 =v ss +0.5 v v oh4 =C0.5 v v ol4 =v ss +0.5 v v ss =C5 v, v oh4 =C0.5 v v ss =C5 v, v ol4s =v ss +0.5 v v oh5 =C0.5 v v ol5 =v ssl +0.5 v v oh6 =C0.2 v (v dd level) v omh6 =v ss1 +0.2 v (v ss1 level) v omh6s =v ss1 C0.2 v (v ss1 level) v oml6 =v ss2 +0.2 v (v ss2 level) v oml6s =v ss2 C0.2 v (v ss2 level) v ol6 =v ss3 +0.2 v (v ss3 level) v oh =v dd v ol =v ss2 C6 C2 C0.7 ma 0.7 2 6 ma C9 C3 C1 ma 139ma C6 C2 C0.7 ma 0.7 2 6 ma C3.0 C1.2 C0.2 ma 15 30 100 m a C1.5 C0.6 C0.15 ma 0.15 0.6 1.5 ma ma C2 C0.7 C0.2 ma 0.2 0.7 2.0 ma C6 C2 C0.7 ma 0.7 2 6 m a C4 m a 4 m a 4 m a C4 m a 4 m a 0.3 m a C0.3 m a C4 2 (v dd =v dda =0 v, v ss1 =v ssl = C1.5 v, v ss2 =v ss =v ssa = C3.0 v, v ss3 = C4.5 v, ta= C40 to +85c unless otherwise specified)
16/25 ? semiconductor msm64169 dc characteristics (continued) parameter symbol condition min. typ. max. unit measur- ing circuit input current 1 (p0.0 to p0.3) (p1.0 to p1.3) (p2.0 to p2.3) input current 2 (opp0, opp1, opn0, opn1, v of ) input current 3 (vra) input current 4 (osc1) input current 5 ( reset , tst1 , tst2 ) input current 6 (r cm , c z1 , c z2 ain0 to 3, r a ) input voltage 2 (osc1, reset , tst1 , tst2 ) i ih1 i il1 i ih1s i il1s i il2 i ih2z i il3 i ih3 i il4 i ih4z i il4z i ih5 i il5 i ih6z i il6z v ih1 v il1 v ih1s v ih2 v il2 v ih1 =v dd v il1 =v ss v ih1 =v dd, v ss =C5 v v il1 =v ss =C5 v v il2 =v ssa v ih2 =v dd v il3 =v ssa v ih3 =vra+30 mv v il4 =v ss2 v ih4 =v dd v il4 =v ss2 v ih5 =v dd v il5 =v ss2 v ih6 =v dd v il6 =v ssa v ss =C5 v 30 90 300 m a C300 C90 C30 m a 80 250 800 m a C800 C250 C80 m a C300 C90 C30 m a 01 m a C375 C250 C125 m a 18ma C300 C110 C10 m a 01 m a m a C1 0 m a 01 ma C3 C1.5 C0.75 m a 01 m a C1 0 C0.6 0 v C3.0 C2.4 v C1 0 v C0.6 0 v C3.0 C2.4 v 3 i ih1z v ih1 =v dd 01 m a i il1z v il1 =v ss C1 0 m a (when pulled down) (when pulled up) (when pulled down) (when pulled up) (at high impedance) (at high impedance) (when pulled up) (at high impedance) (enadc=0) i il2z v il2 =v ssa C1 0 m a (at high impedance) (enadc=1) (when pulled up) (at high impedance) (at high impedance) (at high impedance) (at high impedance) input voltage 1 (p0.0 to p0.3) (p1.0 to p1.3) (p2.0 to p2.3) v ss =C5 v v il1s C5C4 v (v dd =v dda =0 v, v ss1 =v ssl = C1.5 v, v ss2 =v ss =v ssa = C3.0 v, v ss3 = C4.5 v, ta= C40 to +85c unless otherwise specified) 4
17/25 ? semiconductor msm64169 dc characteristics (continued) parameter symbol condition min. typ. max. unit measur- ing circuit hysteresis width (p0.0 to p0.3) (p1.0 to p1.3) (p2.0 to p2.3) d v t1 d v t1s c in v ss =C5 v 0.2 0.5 1 v 0.25 1.0 1.5 v 5 pf 4 hysteresis width ( reset , tst1 , tst2 ) d v t2 0.2 0.5 1 v input capacitance (p0.0 to p0.3) (p1.0 to p1.3) (p2.0 to p2.3) (v dd =v dda =0 v, v ss1 =v ssl = C1.5 v, v ss2 =v ss =v ssa = C3.0 v, v ss3 = C4.5 v, ta= C40 to +85c unless otherwise specified) 1
18/25 ? semiconductor msm64169 a/d converter characteristics * "s" indicates a sign bit. voltage amplification circuit characteristics *1 errors caused by offset voltage are excluded. *2 errors decrease in proportion to gain. parameter (pin name) symbol condition (*1) min. typ. max. unit measur- ing circuit amplifier gain error *1 eg (*2) v opp1 Cv opp0 =10 ma, gain=40 eg= (v opo1 Cv opo0 )/(v opp1 Cv opp0 ) C1 gain C3.0 C1.5 0 % level shift error *1 ei ei= (v ain3 Cv vof ) C1 (v opo1 Cv opo0 ) C4+4% (v dd =v dda =0 v, v ss2 =v ss =v ssa = C3 v, ta= C40 to +85c unless otherwise specified) 5 parameter (pin name) symbol condition min. typ. max. unit measur- ing circuit analog input voltage range (ain0 to ain3) analog input voltage range (opp0, opp1) (v of ) resolution linearity error zero scale error full scale error vra voltage (vra) vra temperature coefficient v g voltage (v g ) r a voltage (r a ) v ain C1.2 C0.4 v 12+s* bits C1 +1 lsb C2 +2 lsb C16 +16 lsb vra ta=25c C1300 C1200 C1100 mv C867 C800 C733 mv v g ta=25c v ra ta=25c C8 2 mv/c (v dd =v dda =0 v, v ss2 =v ss =v ssa = C3 v, ta= C40 to +85c, vra=C1.2 v, at execution of 12-bit a/d conversion, unless otherwise specified) C440 C400 C360 mv 5 v opp C1.6 C0.4 v
19/25 ? semiconductor msm64169 measuring circuit 1 a v v c 1 c 2 xtal c 12 v ss1 v ss3 v ss ca cb xt xt v c z2 c i c z1 r i v dd ain0 vra rcm r i c z1 c i c z2 v g osc1 osc2 v ss2 v dd c l v ssl r os ca, cb, c 12 , c l r os xtal r i c i , c z1 , c z2 cn rs1 rs0 : 0.1 m f : 100 k w : 32.768 khz : 750 k w : 0.1 m f : 1000 pf : 100 k w : 10 k w rs1 rs0 v ssa v dda cn msm64169 measuring circuit 2 a output v dd (*2) input (*1) v ih v il v ss1 v ss2 v ss3 v ssl v ss v ssa v dda msm64169
20/25 ? semiconductor msm64169 measuring circuit 3 a output (*3) input v dda v ss1 v ss2 v ss3 v ssl v ss v dd v ssa msm64169 measuring circuit 4 *1 input logic selects specified state. *2 repeated for each specified output pin. *3 repeated for each specified input pin. output v dd input (*3) v ih v il waveform check v ss1 v ss2 v ss3 v ssl v ss v dda v ssa msm64169
21/25 ? semiconductor msm64169 measuring circuit 5 c 1 c 2 xtal c 12 v ss1 v ss3 v ss ca cb xt xt c z2 c i c z1 r i v dd ain0 vra rcm r i c z1 c i c z2 v g opn1 opo1 v ss2 v dd c l v ssl r1 ca, cb, c 12 , c l xtal r i c i , c z1 , c z2 cn r a rv of r s r0, r1 r g : 0.1 m f : 32.768 khz : 750 k w : 0.1 m f : 1000 pf : 10 k w : 10 k w max : 10 k w max : 270 k w : 100 k w max r s r a v ssa v dda cn v of r a rv 0f opn0 r g opo0 r0
22/25 ? semiconductor msm64169 functional description cpu peripheral function ? a/d converter (adc) the msm64169 has a 4-channel input dual slope a/d converter. in dual slope a/d conversion, the relationship between integral voltage and time is given by: vin/vr = t1/t2 where, t1 = given time for which an analog input voltage is integrated vr = reference voltage vin = voltage resulted from charging for t1 t2 = time required to discharge the voltage, from vr to vin from the above equation, vin is found. the range of vin is C0.8 0.4 v. the a/d converter resolution time is programmable. the a/ d converter has a preamplifier for amplifying a microvoltage. it is suited to applications such as thermometer, pressure gauge, and hygrometer. ? lcd driver (lcd) the msm64169 has a built-in lcd driver for 64 outputs. the lcd driver consists of 64 4-bit display registers (64 nibbles out of dspr0 to 127), a display control register (dspcon), a 63-output lcd driver circuit, and a bias generation circuit (bias). there are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. a mask option can select either a common driver or a segment driver for each lcd driver pin. a mask option can also specify the assignment of each bit of the display register to each segment. l0 to l7 of the lcd driver can become output ports via a mask option. the relationship between the duty, the bias method and the maximum segment number follows: 1/4 duty 1/3 bias method ......... 240 segments 1/3 duty 1/3 bias method ......... 184 segments 1/2 duty 1/2 bias method ......... 124 segments ? port (p0, p1, p2) the msm64169 has three input-output ports (p0, p1, p2) with 4 bits each. each bit of the ports can be configured to be an input or output, pull-up/pull-down resistor input or high impedance input, or nmos open drain output or cmos output. a change in the input level of each pin of p0 and p1 generates an external interrupt 0 request, and a change in the input level of each pin of p2 generates an external interrupt 1 request. the serial port function and the timer function area assigned as the secondary funciton. ? buzzer driver (bd) the msm64169 has a built-in buzzer driver with two buzzer output frequencies and four buzzer output modes. each buzzer output is selected by the buzzer control register (bdcon) and the buzzer frequency control register (bfcon). ? serial port (siop) the msm64169 has a serial port (siop). the serial port is a synchronous/asynchronous selectable serial communication port. the transmit section and the receive section are independent of each other, which allows simultaneous operation of transmission and receiving.
23/25 ? semiconductor msm64169 ? watchdog timer (wdt) the msm64169 has a built-in watchdog timer to detect cpu run-away. the watchdog timer consists of a 6-bit watchdog timer counter (wdtc), which counts the 16 hz output of the time base counter, and a watchdog timer control register (wdtcon) to reset wdtc. ? capture circuit (cap) the msm64169 captures a 32 hz to 256 hz output of the time base counter at the falling edge of port 1.0 or 1.1 (p1.0 or p1.1) when the pull-up resistor input is chosen, or at the rising edge when the pull-down resistor input is chosen. the capture circuit is composed of the capture control register (capcon) and the capture registers (capr0, capr1) that fetch output from the time base counter. ?timer (tm) the msm64169 has a 16-bit timer (tm). the timer has three operation modes: auto-reload mode, capture mode, and clock frequency measuring mode. it counts at 32.768 khz or 700 khz or by an external clock. the timer is used for pulse generation, time measurement, etc., and is also used as an a/d conversion counter at a/d conversion and as a baud rate generator at serial communication. ? clock generation circuit (2clk) the msm64169 has a clock generation circuit (2clk) that generates clocks of two types: low- speed and high-speed. the circuit consists of a 32.768 khz crystal oscillation circuit, a 700 khz rc oscillation cricuit, and a clock control section. this circuit generates the system clock (clk), crystal oscillation clock (32.768 khz), and rc oscillation clock (700 khz). the system clock is the basic operation clock of the cpu, and the crystal oscillation clock is the basic operation clock of the time-base counter and the buzzer driver. the crystal oscillation clock and rc oscillation clock are supplied to the timer to become a timer clock. the system clock frequency is switched between 32.768 khz (output of the crystal oscillation circuit) and 700 khz (output of the rc oscillation circuit) based on the contents of the frequency control register (fcon). note: the oscillation frequency of the rc oscillation circuit varies depending on the value of external resistor (r os ), operating voltage (v ss2 ), and ambient temperature (ta). ? time base counter (tbc) the msm64169 has a built-in time base counter (tbc) that generates clocks to be supplied to internal peripheral circuits. the time base counter is composed of 15 binary counters. the count clock of the time base is supplied by the oscillation clock (32.768 khz) of the crystal oscillation circuit. output of the time base counter is used for buzzer driver, system reset circuit, watchdog timer, time base interrupt, sampling clocks for each port, and lcd driver. ? interrupt (intc) the msm64169 has ten interrupt sources (ten vector addresses) of which two are external interrupts from ports and eight are internal interrupts. of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). the other nine interrupts are controlled by the master interrupt enable flag (mi) and the interrupt enable registers (ie0, ie1 and ie2). when an interrupt condition is met, the program branches to a vector address corresponding to the interrupt source, and then control is passed to the interrupt routine.
24/25 ? semiconductor msm64169 application circuit lcd l63 l0 msm64169-xxx osc2 osc1 reset v dd xt xt p1.0 p1.1 p1.2 p1.3 p0.0 p0.2 p0.3 p2.1 v dd c 2 c 1 v ss3 v ss2 v ss v ss1 v ssl tst2 tst1 bd v g c z2 r i r cm c zi c i v ssa ain2 r os 32.768 khz c gex c12 c3 c1 cl c2 3 v 5 v cs cz2 r i cz c i switch matrix (4 4) ? 5 v interface ? pressure measurement by pressure sensor (ain0, 3) ? temperature measurement by thermistor (ain1) ? detection of low voltage (ain2) ?c gex for crystal oscillation circuit : external fixing cn ain1 vra v of ain3 opp0 opp1 ain0 r a v dda opo0 opn0 opn1 opo1 pressure sensor p2.0 p0.1 txd rxd asynchronous serial communication
25/25 ? semiconductor msm64169 (unit : mm) package dimensions notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). qfp128-p-1420-0.50-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 1.19 typ. mirror finish

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